精算师考试科目-广西警官高等专科学校

APPROVAL SHEET





AOT MODEL NAME
AOT PART NUMBER
CUSTOMER NAME
DATE
VERSION








3014F
3014C-W3M6
CMI
2011March
1
Prepared




MAKER
Checked

Approved



CUSTOMER
















AOT Headquarters
No. 13, Gongye 5th. Road, Hsinchu Industrial Park, Hukou Shiang,
Hsinchu Hsien 303, Taiwan, R.O.C.
TEL: +886-3-597-6988 FAX: +886-3-598-7392








3014C-W3M6 Page 1 of 15

Revision Note

Date
2011-03-08
























Revision
Initiate Document
























Page
15















































Version
1

3014C-W3M6 Page 2 of 15

Package Outline
Type Number: 3014C-W3M6
Unit: mm, Tolerance: ± 0.2 mm


Item
Package
Encapsulating Material
Electrode

Materials
Heat- Resistant Polymer
Silicone ( with phosphor )
Ag Plating Copper Alloy

• Single blue chip.
• High brightness SMD.
• Compact package outline (LxWxH) of 3.0 mm x 1.4 mm x 0.52 mm.
• Compatible with reflow soldering.
• Complies with RoHS Directive.

3014C-W3M6 Page 3 of 15

Item
Forward Voltage
Luminous Flux
Reverse Current

OpticalElectronic Characteristics (Ta=25°C)
Symbol
V
F

φ
V

I
R

Condition
I
F
= 60 mA
I
F
=60mA
V
R
=5V
Value
2.8 ~ 3.4
14 ~ 18.5
≦2.0
Unit
V
lm
µA

* V
F
measurement allowance is ±0.05V

* Dominant wavelength measurement allowance is ±1nm

* Luminous
flux
is NIST reading. Luminous
flux
tolerance: ±10%



Absolute Maximum Ratings (Ta=25°C)
Item
Forward Current
Peak Pulse Forward Current; (1kHz,110 duty cycle)
Reverse Voltage.
LED Junction Temperature.
Operating Temperature.
Storage Temperature.
Power Dissipation
Soldering Temperature
Symbol
I
F

I
FP

V
R

T
j

T
opr

T
stg

P
D

T
sld

Maximum Value
60
100
5
120
-30 ~ +85
-40 ~ +85
204
Unit
mA
mA
V
°C
°C
°C
mW
Reflow Soldering 260℃,10sec



3014C-W3M6 Page 4 of 15

Group Definition of Forward Voltage
Rank
L1
L2
Condition
T
a
=25C
I
F
=60mA
o
V
F
(V)
2.8 ~ 3.1
3.1~3.4


Group Definition of Brightness
Rank
Rank X2075
Rank X2000
Rank X1925
Rank X1850
Rank X1775
Rank X1700


T
a
=25C
I
F
=60mA
o
Condition
φv(lm)
17.75 ~ 18.50
17.00 ~ 17.75
16.25 ~ 17.00
15.50 ~ 16.25
14.75~ 15.50
14.0 ~ 14.75
40mA and 60mA Table of Brightness and CIE
40mA
φv(lm)
Iv
CIE-x
x
CIE-y
y
φv(lm)
Iv * 1.37
60mA
CIE-x
x-0.002
CIE-y
y-0.002


*A shipment shall consist of the LEDs of a combination of different ranks of luminous flux,
wavelength and forward voltage. The percentage of each rank in the shipment shall be determined by AOT
*The ranking information of LEDs can be found on the reel label.




















3014C-W3M6 Page 5 of 15

Group Definition of Chromaticity Coordinate

Chromaticity coordinate groups are measured with an accuracy of ±0.01.


3014C-W3M6 Page 6 of 15

OpticalElectronic Characteristics

Forward Current vs. Relative Luminous Flux
(Ta=25℃)
2
1.8
R
e
l
a< br>t
i
v
e

L
u
m
i
n
o
u
s

F
l
u
x
(
a
.
u
.
)
1 .6
1.4
1.2
1
0.8
0.6
0.4
0.2< br>0

Forward Current IFP (mA)
120
Forward Voltage vs. Forward Current
(Ta=25℃)
120
110
100
90
80
70
60
50
40
30
20
10
0
Ta=25
℃
Ta=25
℃
F
o
r
wa
r
d

C
u
r
r
e
n
t

I
F
P

(
m
A
)
00.511 .522.533.544.55
Forward Voltage VF(V)
Ambient Temperature vs. Forward Voltage
(I
FP
=60mA)


Ambient Temperature vs. Relative Luminous Flux
(I
FP
=60mA)

1.6
R
el
a
t
i
v
e

L
u
m
i
n
o
u
s

F
l
u
x
(
a
.
u
.
)
1 .4
1.2
1
0.8
0.6
0.4
010
4.5< br>F
o
r
w
a
r
d

V
o
l
t
a
g
e

V
F
(
V
)
4
3.5
3
2.5
2
1. 5
IFP=60mAIFP=60mA
Ambient Temperature Ta(
℃
)
2090100
07080
Ambient Temperature Ta(
℃
)
90100


Forward Current vs. Chromaticity Coordinate
(Ta=25℃)
Ambient Temperature vs. Chromaticity Coordinate
(I
FP
=60mA)
0.27
0.2675
0.265
0.2625
0.26
0.257 5
0.255
0.2525
0.25
0.280.2820.2840.28 6
40mA
50mA
60mA
70mA
80mA
Ta=25
℃
0.26
IFP=60mA
15℃
0.2575
65℃< br>0.255
25℃
45℃
85℃
y
y
0.2880. 29
0.2525
x
0.25
0.2750.27750.280.2825 0.2850.28750.29
x

3014C-W3M6 Page 7 of 15

Spectrum

Radiation Pattern




























3014C-W3M6 Page 8 of 15

Recommended Reflow Soldering Conditions

Surface Mounting Condition

In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling
forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and
mechanical damages of the devices.

Soldering Reflow
-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications.
-SMD LEDs are designed for Reflow Soldering.
-In the reflow soldering, too high temperature and too large temperature gradient such as rapid
heatingcooling may cause electrical & optical failures and damages of the devices.
-AOT cannot guarantee the LEDs after they have been assembled using the solder dipping method.

1) Lead Solder
Classification Reflow Profile (JEDEC J-STD-020C)
275
250
225
200
183
o
C
60-150sec
Ramp up
3
o
Csec Max.
235-240
o
C

Te
m
p
e
r
a
t
u
r
e
(
o
C
)
175
150
125
10 0
75
50
360sec Max
Preheat
60-120sec
Ramp down
6
o
Csec Max.
25

Time (sec)




3014C-W3M6 Page 9 of 15

2) Lead-free Solder




3) Manual Soldering Conditions
- Lead Solder
o
Max. 300C for Max. 3sec, and only one time.
- Lead-free Solder
o
Max. 350C for Max. 3sec, and only one time.


- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient
atmosphere during reflow. It is recommended to use the nitrogen reflow method.
- After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head
soldering iron should be used. It should be confirmed beforehand whether the characteristics of the
LEDs will be damaged by repairing or not.
- Reflow soldering should not be done more than two times.

3014C-W3M6 Page 10 of 15

Quantity: 2,500 pcsreel
Taping and Orientation




Item
W
E
F
D
0

D
1

P
0




Spec.
8.00
1.75
3.50
1.50
0.72
4.00



Tolerance(mm)
±0.10
±0.10
±0.05
+0.10
±0.10
±0.10



Item
P
2

t
A
0

B
0

K
0





Spec.
2.00
0.25
1.53
3.20
0.72




Tolerance(mm)
±0.05
±0.02
±0.10
±0.10
±0.10












3014C-W3M6 Page 11 of 15

Packing Formation









Diameter : 178 mm

Width : 8 mm

2,500 pcsReel

Antistatic Reel

+
5g drying agent












302






Package Outlook















Antistatic Shielding Metal Bag

1 Reel Bag




25 Metal Bag1 Carton

62,500 pcs 1Carton
267
524

















Advanced Optoelectronic Technology Inc.

Customer
Customer PO No.
Part No.













Customer PN.
Quantity
Packing Date
Carton No.
QC Check
3014C-W3M6 Page 12 of 15

Reel Label Definition



PN ： a



Lot No ：AYMDxxxx -xxx:



Qty：nn EA











Bin(VfIvCIE) ：b-c-d




Vendor PN ：3014C-W3M5

Min Max

Vf(V) e f

Iv(lm) g h
SN ：SYMDxxxx




LBin(VfIvCIE) ：
Vendor PN：3014C-W3M6
SN：
a : Customer part number
b : Forward voltage range
c : brightness range
d : CIE range
e : min Vf
f : max Vf
g : min Iv
h : max Iv
nn : quantity of LED
AYMDxxxx –xxxx: A: AOT, Y: year, M: month, D: day, xxxx-xxx : serial No.
SYMDxxxx: S: AOT
factory
, Y: year, M: month, D: day, xxxx : serial No




















3014C-W3M6 Page 13 of 15

Reliability Test

No. Test Item
Steady State
Operating Life
Thermal Shock

Standard Test
Internal Ref.
JESD22-A106-A
JESD22-A103-A
Internal Ref.
JESD22-A101-B
Internal Ref.
Test
I
F
=20 mA
o
Ta=25C
-40C ~ 85C
Hold 30 min
Ta=125C
Ta=-40C
Ta=85C
RH=85%
2 sec ON - 2sec OFF
o
o
o
o o
Note
168 hr
84 cycles
168 hr
168 hr
168 hr
100,000 cycles
Number of
020
020
020
020
020
020
1
2
3
4
5
6
High Temperature
Storage
Low Temperature
Storage
High Temperature
High Humidity
On-Off Test

Criteria for Judging Damage
Item
Forward Voltage
Reverse Current
Luminous Flux
Symbol
V
F

I
R

φ
V

Test Conditions
I
F
=140mA
V
R
=5V
I
F
=140mA
Criteria for Judgment
Min. Max.
- *U.S.L×1.1
- *U.S.L×2.0
*L.S.L×0.7 -







* U.S.L: Upper Standard Level
* L.S.L: Lower Standard Level
3014C-W3M6 Page 14 of 15

Cautions
1. Storage Conditions

Before opening the package:
The LEDs should be kept at 30℃ or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material is recommended.
After opening the package:
The LEDs should be kept at 30℃ or less and 70%RH or less. The LEDs should be soldered within
168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material.
It is also recommended to return the LEDs to the original moisture proof bag and to reseal the
moisture proof bag again.
If the moisture absorbent material has faded away or the LEDs have exceeded the storage time ,
baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5 ℃.
AOT LED electrodes are gold plated. The gold surface may be affected by environments which
contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish
or discolor. This corrosion or discoloration may cause difficulty during soldering operations; it is
recommended that the User use the LEDs as soon as possible.
2. Please avoid rapid transitions in ambient temperature especially in high humidity environment
where condensation can occur.
3. Heat generation must be taken into design consideration when using the LED.
4. Power must be applied resistors for protection, over current would be caused the optic damage to
the devices and wavelength shift.
5. Manual tip solder may damage to Chips. It is advised that heat of iron should be lower than 15W
with temperature control less than 5 seconds at 230-260 deg. C. (The device would be damaged in
reworking process if overheat overtime.)
6. All equipment and machinery must be properly grounded. It is recommended to use a wristband or
anti-electrostatic glove when handling the LED.
7. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and
the silicon, Ultrasonic cleaning should not be done.
8. Damaged LED will show unusual characteristics such as remarkably high leaking current, turn-on
voltage becomes lower and the LED gets unlighted at low current.
NOTE.
All the information published is considered to be reliable. However, AOT does not assume any liability
arising out of the application or use of any product described herein.
AOT reserves the right to make changes at any time without notice to any products in order to improve
reliability, function or design.
AOT products are not authorized for use as critical components in life support devices or systems
without the express written approval from the managing director of AOT.
3014C-W3M6 Page 15 of 15