PCBA半成品检验规范
授权委托书英文-营业员工作总结范文
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
1
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
文件变更记录
项次
1
日期
2006.5.19
变更内容简述
增加英文释义
版本
02
昊阳天宇科技(深圳)有限公司
Joy Technology (Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
2
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
1.0
目的：为建立半成品检验与制程稽核标准，以供检验判定良品与不
良品。
1.0
Purpose:
To establish semi-finished goods
inspection and
process audit standard for
judging the qualified product and
unqualified
products .
2.0 适用范围：所有制程稽核均适用。
2.0
Scope:
All process auditing .
3.0
权责：品保单位：负责所有产品检验与制程稽核及本规范之修订。
3.0
Responsibility：QA Dept. : Product inspection and
process
auditing and the revision of this
criterion.
4.0 作业内容
4.0 Action content:
各项检验及稽核重点及稽核如下述。
Each inspection and
audit point, the auditing as below:
5.0 附件
5.0 Attachment
5.1 附件一 无铅焊点与有铅焊点的对照
5.1 The comparison of LF weld and lead weld.
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
3
页
WI
项目
ltem
PTH TU
1
1
2
2
3
极性反
Parts
reversed
缺件
Missing
parts
错件
半成品检验规范
Semi-
finished goods inspection criterion.
判定标准说明
Characteristic
分类
Classifica
条件备注
ConditionR
tion
emark
Maj. Min
1.1
零件极性标记与PCB极性标记相异者
1.1
Part
reversed mark which is different with PCB
polarity mark.
V
V
V
V
V
V
目视 Visual
2.1 PCB
焊垫上应有零件而未焊零件者
2.1 PCB weld pad have a part which is not be
welded.
3.1 PCB
焊垫之零件与BOM料号不同者
The part
of PCB weld pad which is different with
BOM
PN.
PCB weld pad is no need the part which
was
welded.
3 Wrong parts 3.1
4
多件
4.1 PCB
焊垫上不需有零件而焊零件者
4 Excess part 4.1
5.1
零件本体露出底材者
5.1 The material which
is exposed the inside material.
5.2
零件脚有裂痕,破洞者
5.2 The part pin was cracked
and bursted .
5.3
零件本体表面损伤者
5 Damage
part
5.3 The surface of part was damaged .
5.4
套於零件脚上之套管破裂者
5.4 Bushing of
part pin was bursted .
5.5
零件本体变形弯曲者
5.5 Part was distorted .
5.6
零件本体之金属面凹凸者(X'TAL、OSC)
V
V
V
V
5.6 Metal of concave-
convex part.(X'TAL
、OS)
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
4
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
6.1
垂直零件单边高翘,与PCB所形成之夹角≦10°
V
目视
6.1
Plumb part which is lifted singly and
angle of PCB is ≦10°
6.2
垂直零件单边高翘,与PCB所形成之夹角>10°
6.2 Plumb part
which is lifted singly and angle of PCB is>10°
6.3
零件单边高翘,造成PCB背面之零件脚长度<1mm
6.3
Plumb part which is lifted singly, result in
rear part feet
loneness of PCB is <1mm.
V
V
V
V
V
V
游标卡尺
Vernier
caliper
V
V
Visual
Visual
6.4
零件单边高翘,造成背面零件脚未露出
6.4
Plumb part which
is lifted singly and results in
rear part pin
is not exposed.
6
高翘
Turnnup
6.5
Paste PCB on the bottom of RJ-45 .
6.6
零件高翘导致组装不良者
6.6 The part which is lifted
and result in the assembly failed.
6.7
6.7
6.8
6.8
水平零件单边高翘,其本体最底部与高翘端之底部
高度相差≦1.3mm
Level part is lifted singly,the
bottom and lifting of bottom
high is
discrepancy ≦1.3mm
水平零件单边高翘,其本体最底部与高翘端之底部
高度相差>1.3mm
Level part of turnnup single
front,the bottom and turnnup of
bottom high of
discrepancy >1.3mm
※若客戶有特別要求者以客戶要求为标准
6.5
RJ-45之底部未平贴PCB上
※ Follow
the standard of customer if they have special
requests.
7.1
零件倾斜与本体底部所形成之夹角≦15°
V
V
7.1
Slantwise part and the bottom of angle ≦ 15°
偏移
7
Excursio
7.2
零件倾斜与本体底部所形成之夹角>15°
n
7.2 Slantwise
part and the bottom of angle > 15°
7.3
零件倾斜导致组装不良者
7.3 Lean part which
result in the assembly not good.
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
5
页
WI
8
折脚 (跪脚)
Bending
半成品检验规范
Semi-
finished goods inspection criterion.
8.1
零件脚未穿过PCB之贯穿孔
8.1 Pin which is not through
perforation of PCB.
9.1
PCB上的锡未覆盖在焊垫上
9.1 PCB tin have not cover on the weld of pad.
V
V
V
9
锡不足
Non Wetting
9.2
覆盖在焊垫上的锡≦270°
9.2
To cover tin ≦270°on
the weld of pad .
9.3
覆盖在焊垫上的锡>270°
V
9.3 To cover tin > 270°on the weld of pad .
10.1 焊垫锡膏附著面的垂直钉状物
锡尖
Solder paste of
weld pad attached the
10
10.1
plumb
nail.
Icicles
10
焊垫锡膏附著面的水平钉状物
Solder paste of weld pad attached the
10
level nail.
11
PCB焊垫间有锡膏相连接
短路(锡桥)
11
Shorting(Tin
11 PCB weld
pad is connect with solder paste.
brigdge)
11
两零件脚间有焊锡相连接
11 Solder is
connected with 2 part pins.
焊点光泽度不够,焊点表面粗糙者(对于无铅焊接的光
12 冷焊 12
泽度会稍暗淡些）
surface
Colde solder 12
roughness (LF welding glossiness is
gloomy)
空焊
13 13
零件脚与PCB焊垫无焊锡相连接
The pin and PCB weld pad have not connect with
no
13 No solder 13
soldering tin.
14
锡渣,濺锡
14 Solder splasheswebbing.
锡多
15 15
焊锡量覆盖到零件本体
The tin quantity
covers the
15 Excess 15
components main
body
裂锡
16 16
零件脚与焊锡结合缝间有裂痕
Crack
16 The pin and the soldering tin have fissure.
16
V 目视
V
V
V
V
V
V
V
V
Visual
昊阳天宇科技(深圳)有限公司
Joy Technology (Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
6
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
V
V
V
目视
游标卡
尺
Vernier
caliper
17
锡珠直径≦0.13mm
17
Solder fines diameter≦0.13mm
17
锡珠直径≦0.13mm,但距离PCB焊垫或线路≦0.13mm
Solder
fines diameter≦0.13mm,but the distance solder
锡珠
71
17
pad or circuiry ≦0.13mm
Solder fines
17
锡珠直径≦0.13mm,但在一平方英时中数量>5颗
Solder fines
diameter≦0.13mm,but quality>5 pcs in 1
17
square.
17
锡珠直径≦0.13mm,但在一平方英时中数量<5颗
Solder fines diameter≦0.13mm,but quality<5 pcs
in 1
17
square.
18
助焊剂残留:30cm肉眼可看出
18 Welding flux leftover:
30cm naked eye can see.
18
残胶:PCB焊垫上沾胶者
残留物
Remnant rubber: PCB solder pad stained
18
18
with pastern.
Leftover
18
金属残留物
18 Metal leftover.
18
残脚:零件脚未完全剪断
18 Excess pin: Pin have not
be cutted completely.
零件过低
19
零件本体插在焊垫孔内
19
Excess
lowed
The components main body inserts the welding
pad
19
hole.
零件脚过短
20
零件脚被锡覆盖未露出(包焊)
20
Excess
shorted
The components pin has not been
revealed by
20
the tin cover
(Surrounded solder)
21
零件脚长度>2.5mm
V
V
V
V
V
V
V
V
零件脚过长
21
Excess
21 Pin
length >2.5mm
longed
21
於组装时造成短路,或影响功能者
V
21 Result in
short or influence function when assembling.
注:作业指导书及规范未涉及部分依 IPC-A610D CLASS 2定义为准
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
7
页
WI
项目
ltem
半成品检验规范
Semi-finished goods
inspection criterion.
判定标准说明
Characteristic
分类
条件备注
Classific
ation
ConditionRe
mark
Maj. Min
目视
V
V
Visual
SMT
1
极性反
1.1
零件极性标记与PCB上极性标记相异
Parts Part polarity
mark is different with PCB
1 1.1
reversed
polarity mark.
缺件
2.1 PCB
焊垫上应有零件而未焊零件者
2
Missing PCB welds fills up should have
part which is not
2 2.1
parts welded the
part.
错件
3.1 PCB
焊垫之零件与BOM料号不同者
3
Wrong
3 3.1 Part of PCB weld pad is
different with BOM PN.
parts
多件
4.1
PCB
焊垫上不需有零件而焊零件者
4
Excess
4 4.1
PCB weld pad is no need the part which is welded.
parts
5.1
表面损伤(NICK)≦0.25mm
5.1
Surface damaged (NICK)
≦0.25mm
5.2
表面损伤(NICK)>0.25mm
5.2 Surface damaged
(NICK)>0.25mm.
5.3
露底材者
5.3 Revealed
the inside material.
5.4
零件本体有任何裂痕者
5.4 Part has any crack.
损件
Damaged
5.5
两面金属电镀零件之金属部份损伤
parts
Metal part damaged of both sides metal
5.5
galvanization components
5.6
两面金属电镀零件之形状不规则
Shape of the
both sides metal galvanization
5.6
components is irregular
5.7
两面金属电镀零件之金属部分损伤≦25%零件宽
Both sides
metal galvanization metal of
5.7
fractional damaged ≦25% wide.
目视／套板
Visual
V
V
目视／套板
Visual
V
V
V
V
V
V
V
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
8
页
WI
半成品检验规范
Semi-
finished goods inspection criterion.
5.8
两面金属电镀零件之金属部分损伤>25%零件宽
5.8
Both sides
metal galvanization of
fractional damaged
≦25% wide.
The cylindrical components has the
fissure and damage.
V
V
目视／套板
5.9
圆柱形零件本体有裂痕,损伤者
5.9
6
6.1
IC,CONNECTOR底部与PCB距离≦0.25mm
IC,CONNECTOR
bottom and PCB distance
6.1
≦0.25mm.
6.2
IC,CONNECTOR底部与PCB距离>0.25mm
IC,CONNECTOR bottom and PCB distance >
浮件
6.2
0.25mm.
(高翘)
Floating
6.3
被动元件底部与PCB距离≦0.25mm
(Lifting)
6.3
The passive part base and PCB
distance≦0.25mm.
6.4
被动元件底部与PCB距离>0.25mm(10
mils)
The passive part base and PCB
6.4
distance>0.25mm.(10 mils)
6.5
※若客戶有特別要求者以客戶要求为标准
Follow the customer's
request if there is any specific
6.5
request.
7.1
焊垫锡膏附著面的钉状物(垂直)≧0.25mm
V
V
V
V
V
V
V
V
墓碑,侧立
Solder paste of
weld pad attached the
7
Gravestone,
7.1
plumb nail≧0.25mm.
Side
7.2
焊垫锡膏附著面的钉状物(水平)
8
9
短路
Shorting
冷焊
Cold
solder
7.2
Solder paste of
weld pad attached the
nail.(Level)
8.1
PCB焊垫间有锡膏相连接
8.1 PCB weld pad is connected
with paste.
9.1
9.1
焊点光泽度不够,焊点表面粗糙者(对于无铅焊接的光
泽度会稍暗淡些）
surface
roughness (LF welding glossiness is
gloomy)
昊阳天宇科技(深圳)有限公司
Joy
Technology (Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
9
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
V
目视
Visual
游标卡尺
10
零件脚与PCB焊垫无焊锡相连接
空焊
The pin and PCB
weld pad have not connected
10
No
10
with any soldering tin.
solder
10
濺锡，锡渣
10 Solder splasheswebbing
12.
锡珠直径≦0.13mm
1
12.
Solder
balls diameter ≦0.13mm.
1
12
锡珠直径≦0.13mm,但距离PCB焊垫或线路≦0.13mm
12
锡珠
12
Solder balls diameter ≦0.13mm,but the
distance PCB solder pad or circuitry≦0.13mm.
12
锡珠直径≦0.13mm 但在一平方英吋中数量>5颗
Solder
balls diameter ≦0.13mm,but the Qty >5
12
pcs in 1 square.
12
锡珠直径≦0.13mm但在一平方英吋中数量<5颗
Solder balls
diameter ≦0.13mm,but the Qty< 5
12
pcs
in 1 square.
13
焊锡超过零件金属部份上方≧12零件厚
锡多
Soldering tin is exceed the metal part top
13
Excess
13
≧12 thick.
solder
13
焊锡量(高度)超过IC零件脚高度的12 厚
Solder(High)is exceed 12 thick of the IC
13
part pin .
锡不足
14
焊垫上锡的宽度≦50%焊垫宽
14
Non
14
Solder pad of tin wide ≦50% solder pad wide.
wetting
14
零件吃锡面高度≦50%零件脚高度
14
Part wetting high ≦50% part pin high.
15
助焊剂残留:30cm肉眼可眼出
Welding flux remnant 30cm
: we can see by naked
15
eye.
残留物
15
残胶:PCB焊垫上沾胶者
15
Leftover
Remnant rubber: PCB solder pad is stained
15
pastern.
15
金属残留物
15
Metal remnant.
V
V
V
V
Vernier caliper
目视
Visual
V
V
V
V
V
V
V
V
昊阳天宇科技(深圳)有限公司
Joy Technology
(Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
10
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
16
零件金属面超过PCB焊垫左(右)侧宽度>25%零件宽
Part metal is
exceed PCB solder pad left (right)side width
16
>25% part width.
16
零件金属面超过PCB焊垫左(右)侧宽度≦25%零件宽
Part metal is
exceed PCB solder pad left (right)side
16
width≦25% part width.
零件金属面与PCB焊垫
成倾斜,超出焊垫部份
16
≦25%零件宽
Part metal is
sloped with PCB solder pad, exceed the pad
16
≦25% part width.
零件金属面与PCB焊垫 成倾斜,超出焊垫部份
16
>25%零件宽
Part metal is sloped with
PCB solder pad, exceed the pad
>25% part
width.
PCB上相邻两零件各往对方偏移,两零件之间距≦0.25(10mils)
Border
2 parts of PCB excursion,2 parts distance
≦0.25(10mils).
零件金属面往PCB焊垫另一边偏移,焊垫端与零件金属距离
>25%零件宽。
The part metal
surface welds the pad toward PCB one side to
displace , welds the pad and the part metal is
>25% partwide.
零件金属面往PCB焊垫另一边偏移,焊垫端与零件部份金属距离
>25%零件宽。
The partmetal surface welds the pad toward PCB
one side to
displace , welds the pad and the
partmetal is >25% partwide.
V
目视
V
V
V
V
偏 移
Displa
16
cemen
t
V
V
零件金属面往PCB焊垫 另一边偏移,造成零件与旁边之线路距游标卡
V
离≦0.25mm 尺
The partmetal surface welds the
pad toward PCB to
displace,result in
the partis≦0.25mm side line.
圆柱形零件超出PCB焊垫左(右)侧宽度>25%零件宽
V
Column
part is exceeded PCB solder pad left
(right)side width >25% part width.
圆柱形零件超出PCB焊垫左(右)侧宽度≦25%零件宽
V
Column
part is exceeded PCB solder pad left
(right)side width ≦ 25% part width.
17
裂锡
17
零件金属面与焊锡接合面有裂痕
V
17
A crack is between part metal with solder joint.
注:作业指导书有规格未涉及部份依IPC---A--610D CLASS 2 定义为准
Remark : Operation Instruction
is not involved Spec., and shall be followed
IPC-A610D CLASS 2.
昊阳天宇科技(深圳)有限公司
Joy Technology (Shenzhen) Corporation
文件编号 ： Q110-30002
发行日期 ： ２００６．５．１９
修订日期 : 2006.5.19
02
页 次 ： 第
11
之
11
页
WI
半成品检验规范
Semi-finished goods inspection
criterion.
附件一 无铅焊点与有铅焊点的对照