S HENZHENXINGUANGSHUO
TECHNOLOGYCO.,LTD
◆Relia bility
(1)TestItemsandConditions
NO
1
2
3
4
5
6
7
TestItem
Temperat ureCycle
HighTemperatureStorage
HighTemperat ureAnd
HighHumidityWorking
LowTemperatureSto rage
OperatingLifeTest
ThermalShock
IR- ReflowPb-FreeProcess
TestConditions
-40±5℃→2 5±5℃→100±5℃→25±5℃
(30min，5min，30min，5min)100Cyc les
Ta：100±5℃
Testtime=1000HRS(-24HRS,+72HRS )
Ta：85±5℃，R
H
:85±5%，IF=15mA
Testtime =500HRS(-24HRS,+72HRS)
Ta：-40±5℃
Testtime=10 00HRS(-24HRS,+72HRS)
ConnectwithapowerIF=20mATa=Underroomtemperature
Testtime=1000HRS(-24H RS,+72HRS)
-40±5℃→100±5℃
(15min，15min)100Cyc les
①80℃②100℃③120℃④160℃⑤
170℃⑥235℃⑦270℃⑧255℃ ，
60cmmin，2times
Sample
20
20
20
20
20
20
20
Ac
Re
01
01
0 1
01
01
01
01
(2)Criteriaofjudgingt hedamage
Item
Forwardvoltage
Reversecurre nt
Luminous
intensity
Wavelength
Appea rance
Symbol
VF
IR
IV
λDλP

T estcondition
IF=TestCurrent
VR=5V
IF=Test Current
IF=TestCurrent
Viewcheck
Criteria forjudgement
Min.


L.S.L*0.7

M ax.
U.S.L*1.1
15uA

U.S.L±2nm
Nomec hanicaldamage
*
U.S.L:UpperstandardlevelL.S. L:Lowerstandardlevel
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◆Storageandapplicationnotic es
e
SHENZHENXINGUANGSHUO
TECHNOLOGYCO.,L TD
atedshelflifeinsealedbag:12monthsat＜30℃and＜9 0%relativehumidity(RH)
2.1TOPLED:Afterbagisopen ed,devicesthatwillbesubjectedtoreflowsolderorother hightemperature
processmustbe：
a)Mountedwith in:168hoursoffactoryconditions≤30℃60%RH,or
b)St oredatambientof＜20%RH
2.2CHIPLED:Afterbagisopen ed,devicesthatwillbesubjectedtoreflowsolderorother high
temperatureprocessmustbe：
a)Mountedwith in:oneyearoffactoryconditions≤30℃60%RH,or
b)Sto redatambientof＜20%RH
requirebake,beforemounting ,if:
a)HumidityindicatorCardreads＞10%whenreadat 25±5℃
b)Aboveconditionsarenotmet
Bakingcondi tion:24hoursat60±3℃and＜5%RH
4．Theinternalandest erandboxescannotbecontactedwithgroundtopreventabso rptionofmoisture;
5．Noacid,alkali,salt,corrosiv eandexplosivegas;awayfromsunlightandkeeptheenviron mentclean;
ation
1．Donotuseanyunknownchemica lliquidtocleanLED,itwilldamagetheLEDresinsurface;u sethe
alcoholundertheroomtemperatureifnecessary butlessthan1min,orusetheultrasoniccleaning
with propercharacters,suchascorrectpower,frequency,etc;
2．DonottouchtheepoxyresinareawhencarryingLEDsb ytweezers(asthefollowingpictures),
especiallyaf terthesolderingprocess,theepoxyresinwillturntosoft ,theinternalinstructionwillbe
damagedbythetweez erswhichcausetheelectriccharacter’sfailure;nozzlei srecommendedbyusing
SMTmounting.
CorrectInco rrect
3．Solderingiron:double-sidesolderingironw ithpoweroflessthan25W;solderingtemperature:lesstha n
300℃;solderingtime:lessthan3sec.;1timecomplet edisrecommended,ifthe2
nd
solderingprocessis
requested,3minsmustbelefttoensurethehightemper aturestatuscanreturntoroomtemperature;
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SHENZHENX INGUANGSHUO
TECHNOLOGYCO.,LTD
a.
b.
RE FLOWsoldering:setandtestthetemperatureofthediffere ntareaofREFLOW
equipmentinadvance;
Tosetthep eaktemperatureaccordingtodifferentSMDs,buttheactua lpeaktemperatureshouldbe
lessthan260℃,processin gtimeshouldbelessthan10sec,only1timeisallowed;
4．SMDsshouldbesolderedatthecoordinatedpositiononth ePCB;
5．NoteofElectricalmatter:
①One-waycond uction,LEDdoesnotallowthereversedriving;
②LEDis akindofconstantcurrentcomponentwhichcannotbelighte dbytheconstantvoltage
mode;
asmallervoltagef luctuationcancausethelargecurrentfluctuationwhichc ausesthefailureof
LED;
EachLEDshouldbedroveu nderconstantcurrentmodeifinaparallelcircuitdesign, otherwise,
thecolourandbrightnesswillbenonunifo rm;Whentheenvironmentaltemperaturerising,the
LE Djunctiontemperaturewillrise,internalresistancewil ldecrease,sothecurrentwillbe
increasedby
the constantvoltagepowerwhichshortthelifespan;
③Ift hebrightnessoflightingsourcecanmeettherequirement, werecommendusingthe
drivingcurrentlessthanthera tedcurrent,inordertoimprovetheproduct’sreliability ;
6．LEDisakindofelectrostaticsensitivedevises,a nti-staticmeasureshavetobeprocessedduringstorageandoperation:
①LEDproductionworkshopshouldlay anti-staticfloorandgroundconnection,theworktablehavetousetheanti-staticmaterialsandcoveratablema terwiththesurfaceresistanceof
10
6
-10
9
Ω
②Productionmachine:REFLOW,SMTequipment, electriciron,testequipment;allthe
equipmentsmus tbewellgrounded,andthegroundingalternatingcurrenti mpedanceshouldbe
lessthan1.0Ω.
Afanneedtobei nstalledontheequipmentsandproductionprocessesthate asytogenerate
staticelectricity;theoperatorsmus twearanti-staticclothing,shoes,wristband,andgloves ,etc.
intheprocess;
③LEDsmustbecontainedinth eanti-staticbox,andallthepackagematerialshouldbeth e
anti-staticmaterials;
7．Thedetailselectron iccharacterscanrefertoourproductspecification.
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◆
Notes:
SHENZHENXINGUANGSHUO
TECHNOLOGYCO .,LTD
1、reserveauthorityonmaterialchange
for abovespecification.
2、Whenusingthisproduct,plea seobservetheabsolutemaximumratingsandtheinstructio nsfor
menoresponsibilityforanydamageresultingfr omuseoftheproductwhich
doesnotcomplywiththeinst ructionsincludedinthespecificationsheets.
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