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APPROVAL SHEET





AOT MODEL NAME White Color SMD LED
AOT PART NUMBER 30205W21B-N10-A-3AA
CUSTOMER NAME General Customer
DATE 2009December
VERSION 1








MAKER CUSTOMER
Prepared Checked Approved
























30205W21B-N10-A-3AA Page 1 of 15

Revision Note

Date Revision Page Version
15
2009-12-15 Initiate Document 1
















































30205W21B-N10-A-3AA Page 2 of 15

Package Outline
Type Number: 30205W21B-N10-A-3AA
Unit: mm, Tolerance: ± 0.2 mm



Item Materials
Package Heat-Resistant Polymer
Encapsulating Material
Electrode
Silicone (with phosphor)
Ag Plating Copper Alloy


• Single blue chip.
• High brightness SMD.
• Compact package outline (LxWxH) of 3.0 mm x 2.0 mm x 1.3 mm.
• Compatible with reflow soldering.
• Complies with RoHS Directive.

30205W21B-N10-A-3AA Page 3 of 15

Item
Forward Voltage
Luminous Intensity
Color Temperature
Reverse Current




OpticalElectronic Characteristics (Ta=25°C)
Symbol
V
F

I
V

CCT
I
R

Condition
I
F
= 20 mA
I
F
= 20mA
I
F
= 20mA
V
R
=5V
Value
2.9 ~ 3.5
1800 ~ 2600
5310 ~ 7040
≤1
Unit
V
mcd
K
μA

* V
F
measurement allowance is ±0.05V

* Dominant wavelength measurement allowance is ±1nm

* Luminous intensity is NIST reading. Luminous intensity tolerance: ±10%



Absolute Maximum Ratings (Ta=25°C)
Item
Forward Current
Peak Pulse Forward Current; (1kHz,110 duty cycle)
Reverse Voltage.
LED Junction Temperature.
Operating Temperature.
Storage Temperature.
Electrostatic Discharge(HBM)
Electrostatic Discharge(MM)
Power Dissipation
Soldering Temperature
SymbolMaximum Value Unit
I
F
30 mA
I
FP
100 mA
V
R
5 V
T
j
125
°C
T
opr
-30 ~ +85
°C
T
stg
-40 ~ +100
°C
ESD
ESD
±2000
±200
V
V
P
D
105 mW
T
sld

Reflow Soldering 260℃,10sec


30205W21B-N10-A-3AA Page 4 of 15

Group Definition of Forward Voltage
Rank
1
2
3
4
5
6

Condition


T
a
=25
o
C
I
F
=20mA
V
F
(V)
2.9 ~ 3.0
3.0 ~ 3.1
3.1 ~ 3.2
3.2 ~ 3.3
3.3 ~ 3.4
3.4~ 3.5
Group Definition of Brightness
Rank Condition Iv(mcd)
H 1800 ~ 1900
I 1900 ~ 2000
J 2000 ~ 2100
K 2100 ~ 2200
T
a
=25
o
C
I
F
=20mA
L 2200 ~ 2300
M 2300 ~ 2400
N 2400 ~ 2500
O

2500 ~ 2600
Group Definition of Color Temperature


o
5310 6020
T
a
=25C
5700 K


I
F
=20mA
6020 7040
6500 K

*A shipment shall consist of the LEDs of a combination of different ranks of luminance intensity,
wavelength and forward voltage. The percentage of each rank in the shipment shall be determined by AOT
*The ranking information of LEDs can be found on the reel label.

CCT Group Condition Min Max














30205W21B-N10-A-3AA Page 5 of 15

Group Definition of Chromaticity Coordinate

0.380




5700 K

0.360
6500 K

a5

0.340
C
I
E

-

Y
a7

a3

a1

0.320
a8

a6
a4

a2

0.300
0.280
0.2700.2900.310
CIE - X
0.3300.3500.370

Chromaticity coordinate groups are measured with an accuracy of ±0.01.

CCT Rank x y Rank x y
0.3048 0.3205
a1
6500K
a3
0.3016 0.3356
0.3107 0.3448
0.3130 0.3286
0.3130 0.3286
0.3107 0.3448
0.3198 0.3540
0.3212 0.3368
0.3214 0.3348
a5
5700K
a7
0.3200 0.3520
0.3378 0.3680
0.3370 0.3486
0.3292 0.3417
0.3289 0.3600
0.3378 0.3680
0.3370 0.3486
a8
a6
a4
a2
0.3080 0.3054
0.3048 0.3205
0.3130 0.3286
0.3153 0.3125
0.3153 0.3125
0.3130 0.3286
0.3212 0.3368
0.3226 0.3196
0.3228 0.3176
0.3214 0.3348
0.3370 0.3486
0.3362 0.3292
0.3295 0.3234
0.3292 0.3417
0.3370 0.3486
0.3362 0.3292

30205W21B-N10-A-3AA Page 6 of 15

OpticalElectronic Characteristics
Forward Current vs. Relative Luminosity
2.5
R
e< br>l
a
t
i
v
e

L
u
m< br>i
n
o
s
i
t
y

(
a< br>.
u
)
F
o
r
w
a
r
d< br>
C
u
r
r
e
n
t

I
F
P

(
m
A
)
Forward Current vs. Forward Voltage
60
5040
30
20
10
0
00.511.522.533.54Forward Voltage VF (V)
2.0
1.5
1.0
0 .5
0.0
0
Forward Current IFP(mA)

Pattern Spectrum Radiation
30
o
20
o
10
o
0
o
1.0
R
e
l
a
t
i
v
e

E
m
i
s
s
i
o
n

I
n
t
e
n
s
i
t
y

(
a
.
u
.
)
100
80
60< br>50
o
40
o
0.8
0.6
40
60
o
0.4
20
70
o
0.2
0
4
Wavelength λ (nm)
80
o
90
o
0





30205W21B-N10-A-3AA Page 7 of 15

Recommended Reflow Soldering Conditions

Surface Mounting Condition




In automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling
forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and
mechanical damages of the devices.

Soldering Reflow
-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications.
-SMD LEDs are designed for Reflow Soldering.
-In the reflow soldering, too high temperature and too large temperature gradient such as rapid
heatingcooling may cause electrical & optical failures and damages of the devices.
-AOT cannot guarantee the LEDs after they have been assembled using the solder dipping method.

1) Lead Solder
Classification Reflow Profile (JEDEC J-STD-020C)
275
250
225
200
o
235-240
o
C

Ramp up
3
o
Csec Max.
T
e
m
p
e
ra
t
u
r
e

(
o
C
)
183 C
60-150sec
175< br>150
125
100
75
50
360sec Max
Preheat
60-120sec
Ramp down
6
o
Csec Max.
25

Time (sec)




30205W21B-N10-A-3AA Page 8 of 15

2) Lead-free Solder






Classification Reflow Profile (JEDEC J-STD-020C)
300
275
250
225
217 C
o
255-260
o
C

Ramp up
3
o
Csec Max.
T
e
m
p
e
ra
t
u
r
e

(
o
C
)200
175
150
125
100
75
50
4 80sec Max
Preheat
60-180sec
60-150sec
Ramp down
6
o
Csec Max.
25

Time (sec)


3) Manual Soldering Conditions
- Lead Solder
Max. 300
o
C for Max. 3sec, and only one time.
- Lead-free Solder
Max. 350
o
C for Max. 3sec, and only one time.


- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient
atmosphere during reflow. It is recommended to use the nitrogen reflow method.
- After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head
soldering iron should be used. It should be confirmed beforehand whether the characteristics of the
LEDs will be damaged by repairing or not.
- Reflow soldering should not be done more than two times.

30205W21B-N10-A-3AA Page 9 of 15

Quantity: 2,500 pcsreel

Taping and Orientation



















α
-
α
+

Item Spec. Tolerance(mm)Item Spec. Tolerance(mm)
W 8.00
±0.20
E 1.75
±0.10
F 3.50
±0.05
P2 2.00
±0.05
t 0.23
±0.05
A0 2.25
±0.10
3.30
±0.10
D0 1.50 +0.10, -0 B0
D1 1.00
±0.10
P0 4.00
±0.05

K0 1.65
±0.10
α
Max 5°

















30205W21B-N10-A-3AA Page 10 of 15

Packing Formation








Diameter : 178 mm

Width : 8 mm

2,500 pcsReel

Antistatic Reel













302







Package Outlook










95


260



230



Antistatic Shielding Aluminum Bag

1 Reel Bag



















524































267



240
270
5 Bags 1Inner Box
12,500 pcs 1 Inner Box
5 Inner Box1 Carton
62,500 pcs 1Carton

Advanced Optoelectronic Technology Inc.
Customer
Part Number
Quantity
Date










Remarks
30205W21B-N10-A-3AA Page 11 of 15

Reel Label Definition



SMD LED, White 3020

Part No. : 30205W21B-N10-A-3AA

Brightness : a - b mcd

CIE : c

V
F
: d - e v

Quantity : nn ea

Serial No. : SHyymmddxxx


a,b : brightness range
c : CIE Rank ( a1, a2, a3, a4 )
d-e : forward voltage range
nn : quantity of LED
SHyymmddxxx: yy : year, mm : month, dd : day, xxx : reel No.






































30205W21B-N10-A-3AA Page 12 of 15

Reliability Test

No.

Test Item

Steady State
Operating Life
Thermal Shock





Standard Test
Method
Test
Conditions
I
F
=20 mA
Ta=25
o
C
-40
o
C ~ 85
o
C
Hold 30 min
Note

1000 hr
84 cycles
Number of
Damaged
1
2
3
4
5
6
Internal Ref.
JESD22-A106-A
020
020
=
High Temperature
=
JESD22-A103-A
=
Storage
Low Temperature
Storage
High Temperature
High Humidity
On-Off Test
Internal Ref.
JESD22-A101-B
Internal Ref.
hr 020
Ta=125
o
C 500
Ta=-40
o
C 500 hr 020
Ta=85
o
C
RH=85%
2 sec ON - 2sec OFF
500 hr
100,000 cycles
020
020

Criteria for Judging Damage

Criteria for Judgement

Item Symbol Test Conditions
Min. Max.

Forward Voltage V
F
I
F
20mA - *U.S.L×1.1

Reverse Current
Luminous Intensity
I
R

I
V


V
R
5V - *U.S.L×2.0
I
F
20mA *L.S.L×0.7 -


* U.S.L: Upper Standard Level
* L.S.L: Lower Standard Level






















30205W21B-N10-A-3AA Page 13 of 15

Cautions
1. Storage Conditions





Before opening the package:
The LEDs should be kept at 30℃ or less and 90%RH or less. The LEDs should be used within a
year. When storing the LEDs, moisture proof packaging with absorbent material is recommended.
After opening the package:
The LEDs should be kept at 30℃ or less and 70%RH or less. The LEDs should be soldered within
168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in
moisture proof packages, such as sealed containers with packages of moisture absorbent material.
It is also recommended to return the LEDs to the original moisture proof bag and to reseal the
moisture proof bag again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65 ± 5 ℃.
AOT LED electrodes are gold plated. The gold surface may be affected by environments which
contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish
or discolor. This corrosion or discoloration may cause difficulty during soldering operations; it is
recommended that the User use the LEDs as soon as possible.
2. Please avoid rapid transitions in ambient temperature especially in high humidity environment
where condensation can occur.
3. Heat generation must be taken into design consideration when using the LED.
4. It is recommended to have protection circuit. Over current might damage the devices or cause
wavelenth shift.
5. Manual tip solder might cause damage to chips. It is recommended that the power of the iron
should be lower than 15W, with temperature control. The iron should be applied less than 5
seconds at 230~260 deg C (The device would be damaged in the reworking process if overheat
overtime.)
6. All equipment and machinery must be properly grounded. It is recommended to use a wristband or
anti-electrostatic glove when handling the LED.
7. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package and
the silicon. Ultrasonic cleaning is not recommended.
8. Damaged LED will show unusual characteristics such as remarkably high leaking current, turn-on
voltage becomes lower and the LED gets unlighted at low current.
9. The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the
top of package. The pressure to the top surface will be influence to the reliability of the LEDs
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using
the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.
NOTE.
All the information published is considered to be reliable. However, AOT does not assume any liability
arising out of the application or use of any product described herein.
30205W21B-N10-A-3AA Page 14 of 15

AOT reserves the right to make changes at any time without notice to any products in order to improve
reliability, function or design.
AOT products are not authorized for use as critical components in life support devices or systems
without the express written approval from the managing director of AOT.
30205W21B-N10-A-3AA Page 15 of 15