平顶山工业技术学院-美国感恩节

ＳＰＥＣＩＦＩＣＡＴＩＯＮ　ＦＯＲ　ＡＰＰＲＯＶＡＬ
規　格　書

（客 戶／代碼）
ＣＵＳＴＯＭＥＲ＇Ｓ　ＣＯＤＥ
（品名）
ＤＥＳＣＲＩＰＴＩＯＮ：３５２８带透镜黄光
（本廠型號）
ＲＡＲＴ　ＮＯ．：
ＴＭ－Ｓ３５２８ＤＴＪＹ
２０１５－０６－２６
Ｇｒｅａｔｂｒｉｇｈｔ２０１５３５２８Ｙ
ＤＡＴＥ：
（日期）
（檔案號）
ＲＥＦＥＲＥＮＣＥ　ＮＯ．
Ａｐｐｒｏｖｅｄ　Ｂｙ　Ｃｕｓ ｔｏｍｅｒ
客戶承認
Ｑｕａｌｉｆｉｅｄ　Ｂｙ
　Ｆｏｒｍ　Ｄｅｓｉｇｎｅｒ
核准
司徒立勝
　製作
歐陽真
台灣臺銘光電科技股份有限公司（東莞）分公司 （Ｇｒｅａｔｂｒｉｇｈｔ臺銘光電）
ＡＤＤ：２６，　ｔｈｅ　ｔｈｉｒｄ　ｉｎｄｕｓｔｒｉａｌ　 ｚｏｎｅ，　Ｆｅｎｇｇａｎｇ　ｔｏｗｎ　ｏｆ　Ｙａｎｔｉａｎ，　Ｄｏｎｇｇｕａｎ　Ｃｉｔｙ，　Ｇｕａ ｎｇｄｏｎｇ　Ｐｒｏｖｉｎｃｅ　Ｃｈｉｎａ
０７６９－８７２８　５３８３
TEL：
WEB
：
ｗｗｗ．ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ


０７６９－８７２８　５３８２
FAX
：





1

E-MIAL∶
ｈｄｑ＠ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ

Package Dimensions And Materials
1.60
0. 70
1.70
1.50
3.10
ｗｗｗ．ｔａｉｍｉｎｇｌｅｄ．ｃｏｍ2-
2.05
2.20
1+
3.50
2-
1:ANOD E
2:CATHODE
Chip
Material
AIGaInP
E mitting Color
Yellow
Lens Color
Water Clear
1+
图片未注差
（
Unless otherwise noted)
±0.1
胶体外观公差
胶体伸出尺寸（
NOTE
)
(
Encapsulation tolerance)
(
Dimensions of produded resin flange)
±0.25
Max1.0
２

Absolute Maximum Rating at TA=25°C
Item
SymbolAbsolute Maximum RatingUnit
mA
mA
V
mW
V
°C
°C
Forward Current
Peak Forward Current
Reverse Voltage
Power Dissipation
Electrostaic discharge
Operation Temperature
Storage Temperature
Lesd Soldering Temperature
If
Ifp
VR
PD
ESD
Topr
Tstg
Tsol
50
150
5
130
3000
-30 -- +80
-40 -- +80
Max.245°C for 5sec Max
IFP Conditions:Pulse Width≤10mser duty≤110
Tsol Conditions: 5mm form the base of the epoxy bulb
Typical OpticalElectrode Characteristic
Item
Forward Voltage
Reverse Current
50
% Power Angle
Luminous Intensity
The Main Wavelength
Recommend Forward Current
Symbol< br>Vf
Ir
2θ12
IV
λD
If(rec)
Cond ition
IF=50mA
Vr=5V
IF=50mA
IF=50mA
IF=50mA
--
Min.
2.0
--
Typ.
--< br>--
40
Max.
2.6
10
Unit
V
u A
deg
4900
585
--
--
50
8200< br>595
MCD
NM
mA
３

Typical OpticalElectrode Characteristic Curves
(Ta=25℃ Unless Otherwise Noted)
RELATIVE RESPONSE 100%=1.642e-G01
100
80
60
40
20
0
400
5
nm
Forward Current vs. Ambient Temperature
Relstive Intensity t Temperature
F
o
r
w
a
r
d

C
u
r
r
e
n
t


I
f

(
m
A
)
R
e
l
a
t
i
v
e

I
n
t
e
n
s
i
t
y

I
V
(
m
c
d
)
Ambient Temperature Ta(°C)
Ambient Temperature Ta(°C)
Forward Current vs. Ambient Temperature
Forward Current vs. Ambient Temperature
F
o
r
w
a
r
d

C
u
r
r
e
n
t


I
f

(
m
A
)
F
o
r
w
a
r
d

V
o
l
t
a
g
e


V
f
(
V
)
Forward Voltage Vf(V)
0
°
-30
°
30
°
Ambient Temperature Ta(°C)
-60
°
60
°
-90°
100
%
80%60%40
%
20
%
020
%
40
%
60
%
80
%
90
°< br>100%
Luminous Spertrum(Ta=25℃)
SPECTRAL RADIANCE
４

Range of bins
IV Ranks(If=50mA)
Bin Code
IV(MCD)
Bin24
4900-6300
Bin25
6300-8200
VF Ranks(If=50mA)
Bin Code
VF(V)
Bin1
2.0 -2.2
Bin2
2.2-2.4
Bin3
2.4-2.6
λ
D Ranks(If=50mA)
Bin Code
Bin1
585-590< br>Bin2
590-595
λ
D(NM)
５

MOISTURE PROOF PACKAGE
防潮包装
●When moisture is absorbed into the SMT package it may vaproize and
expand during soldering. There is a possibility that this can cause
exfoliation of the contacts and damage the optical characteristics of the LEDs.
For this reason ,the moisture proof package is used to keep moisture to a
minimum in the package.
当水分吸收 到SMT封装，会可能在焊接过程中扩大，就有可能
材料出现剥落和损坏LED的光学特性；
出 于这个原因，防潮铝袋是用来保持水分的最小包装
●The moisture proof package is made absorbent material (silica gel
desiccants)is inserted into the aluminium moisture proof bag.
将防潮包装制成的吸收性材料(硅胶干燥剂)放入到防潮铝袋中
●The silica gel desiccants change from blue to red if moisture had penertrated
bags.
如果有水分进入防潮铝袋中，硅胶干燥剂由蓝色变为红色
STORAGE CONDITIONS
储存条件
●Before opeing the package :
打开包装前
The LEDs should be kept at 30℃ or less and 60％ RH or less.
LED应该保存在≤30℃，≤60%RH环境中
The LEDs should be used within 3 months.
When storing the LEDs, moisture proof packaging with absorbent
material (silica gel desiccants)is recommended .
LED保存在防潮铝袋真空包装，防潮铝袋中放硅胶干燥剂时，必须在3个月
内使用，
●After opening the package :
打开包装后
After this bag is opened , devices that will sujected to infraed
reflow , vapor -phase reflow , or equivalent processing
Must be:
防潮包装打开后，将过回流焊处理时，必须：
a)Mounted within 24 hours at factory condition of ≤30℃60％RH.
在≤30℃6 0％RH环境中24小时内使用完
６

b)If unused LEDs remain, they should be stored in the moisture proof package
,such as sealed containers with package of moisture absorbent material (silica
gel deaiccants). It is also recommended to return the LEDs to the original
moisture proof bag and reseal the moisture prrof bag again . Stored at ≤20
％RH.
若不用LED时，LED应该被储存在防潮环境中，如密 封的容器(防潮柜)，另外，还建议LED返
回到原来的防潮袋中，再次重新真空包装，储存在≤20％ RH.
●If the moiature basorbent material (silica gel deaiccants)has faded away or
the LEDs have exceeded the storage time ,baking treatment should be performed
using the following g treatment : than 12 hours at
130℃（Bulk material, ie without Reel)
如果硅胶干燥剂已消失或LED已经超过存储时间，须烘烤处理，烘烤条 件：1.130℃烘烤超
过12小时(散装材料，即不带卷盘包装)
●Please avoid rapaid transitions in ambient temperature,especially in high
humidity environments where condensation can ocuur.
请避免在高温环境，尤其是高湿度的环境中作业
STATIC ELECTRICITY
静电防护
●Static electricity or surge voltage damages the LEDs
It is recommended that a wrist band or an anti- electrostaic glove be used when
handing the LEDs.
静电或过电压会损坏LED，建议在作业时使用防静电手环或者防静电手套
●All devices equipment and machinery must be properly grounded. It is
recommended that precautions be taken against surge voltage to the eauipment
that mounts the LEDs.
所有设备和机台必须正确接地，以避免过电压加 载到LED上
７

Moisture sensitivity level : level 6.
湿度敏感等级：6级
Soldering Condition(Pb-Free)
焊接条件（无铅）
:
烙铁
Soldering Iron:30W Max
烙铁：30W（Max)
Temperature 350°C Max
温度：350度（Max)
Soldering Time:3 Seconds Max(One Time)
焊接时间：3秒（Max)一次

Soldering Profile (Pb- Free)
2.回流焊条件 (无铅)
Pre-heat
Pre-heat time
Peak temperature
Dipping time
Condition
120-150°C
120 sec. Max.
245°C Max.
10 sec. Max.
See below
预热温度
预热时间
峰值温度
峰值温度时间
条件
120-150°C
120 sec. Max.
245°C Max.
10 sec. Max.
见以下
温度Temperature
2.5-5°C
Pre- heating
120-150°C
2.5-5°Csec
120 sec. Max.
120 sec. Max.
245°CMax
Above200°C

时间 Time
８

Reliability Persult
Test
Classifcation
Life Test
Test
Item
Room Temperatuer DC
Operating Life Test
Thermal Shock Test
Temperature Cycle
Test
Test
Condititons
Ta=25℃
±5℃,IF=50mA
-10℃±5℃←→+100℃±5℃
5min. 10sec. 5min
-55℃±5℃←→+85℃±5℃
30min. 5min. 30min
Ta=85℃±5℃
RH=85%±0.5%RH
Test
Duration
1000Hrs
50cycles
50cycles
100 0Hrs
Sample
ACRE
Size
5PCS
5PCS
5PCS
5PCS
5PCS
5PCS
5PCS
5PCS
0 1
01
01
01
01
01
01
01
Env ironment
Test
High Temperature
High Humidity test
High Temperature
Storage
Ta=100℃±5℃
Ta=-55℃±5℃
Ta=245℃±5℃
Load 2.5N(0.25kgf)
0° ~ 90° ~0°
1000Hrs
1000Hrs
Low Temperature
Storage
Mechanical
Test
Resistance to
Soldering Heat
Lead Integrity
5sec
3times
Criteria for Judging The Damage
Item
Forward Voltage
Reverse Current
Luminous IntensitySymbol
V
F
I
R
I
V
Test Con ditions
IF=50mA
V
R
=5V
IF=50mA
Criteria for Judgment
Min.
Max.
U.S.L.*1. 2
U.S.L.*2.2
L.S.L.**×0.7
U.S.L.* : Upper Standard Level
L.S.L.** : Lower Standard Level
９