陕西省国家税务局-垃圾桶标语

SPECIFICATION
(产品规格书)


CUSTOMER
(客 户)
PART NO.
(产品型号)
SPEC NO.
(规格书编号)
:


:

:

DESCRIPTION
:

(产品描述)
DATE
(日期)


:

CUSTOMER APPROED
(客户确认)

色温范围 (K)


光通量 (lm)


电压 (V)





R&D DEPARTMENT
APPROVED
(核准)


CHECKED
(审核)

PREPARED
(制定)

PAGE: 117

PART NO.: SPEC NO.: REV NO.:A-1
●
Feature
◆
Applications

●
Feature
◆
Applications
(特 性) (应 用)
● 12
W High Power LED
( 12 W高功率LED)
●High Luminous Flux
(高光通量)
●Wide Viewing Angle:120°
(视角广泛120°)
●Colloid Color : Water Clear
(胶体颜色：无色透明)

◆ General Lighting
(普通照明)
◆ Advertisement
(广告灯)
◆Architectural Lighting
(建筑照明)
◆ Street Lamps
(路 灯)

■ Package Dimensions
(外观尺寸)

Notes:
1. All dimensions are in millimeters.
(所有尺寸以毫米为单位)
2. Tolerance is ±0.25 unless otherwise noted
(未标注公差为：±0.25)

PAGE: 217

PART NO.:



SPEC NO.: REV NO.:A-1
产品命名规则
GS□-□□□M□- A12C09
a
b
c
d
e
f
g
hijk
a
：公司标识
b
：产品功率
c
：产品发光颜色代码< br>d
：晶片代码
e
：发光角度代码
f
：产品胶体代码
g
：支架型号代码
h
：电压代码
i
：光通量代码
j
：色区代码
k
：色温代码







PAGE: 317

PART NO.: SPEC NO.: REV NO.:A-1
■ ElectricalOptical Characteristics (At T
A
=25°C)
(光 电 参 数)
Parameter
(参数)
Luminous Intensity
(光通量)
Color Temperature
(色温)
Forward Voltage
(正向压降)
Color Rendering
index
显色指数
Thermal Resistance Junction
To Board (热 阻)
Temperature Coefficient of
Forward Voltage
(正向压降之温度系数)
Reverse Current
(反向漏电流)
Symbol
(符号)
Φ
CCT
V
F

Ra
RΘ
J-B

∆V
F
∆T
I
R

Conditions
(测试条件)
I
F
=1050mA
I
F
=1050mA

I
F
=1050mA

I
F
=1050mA

I
F
=1050mA

I
F
=1050mA

V
R
=20V
Min.
(最小值)
1000
2500
12
45



Avg.
(平均值)




3
-8

Max.
(最大值)
1200
7500
14
80


15
Units
(单位)
lm
K
V
− −
°CW
mV°C
μA
■ Absolute Maximum Rating(At TA=25°C)
(极 限 参 数)
Parameter
(参数)
Power Dissipation
(功率)
Continuous Forward Current
(正向输入电流)
[2]
Peak Forward Current
(顺向脉冲电流)
LED Junction Temperature
(结点温度)
Reverse Voltage
(反向电压)
Operating Temperature Range
(工作温度)
Storage Temperature Range
(储存温度)
Manual Soldering Temperature
(手工焊接温度)
ESD Sensitivity
(抗静电能力)

Notes:
[1].

Tolerance Θ:10% (Θ公差为10%)
[2].110 Duty Cycle 0.1ms Pulse Width. (脉冲宽度0.1ms，占空比110)

PAGE: 417
Symbol
(符号)
1
I
F

I
F
(Peak)
T
J

V
R

T
OPR

T
STG

T
SOL
ESD
Ratings
(数值)
13
1050
1500
120
20
Units
(单位)
W
mA
mA
°C
V
-30°C To +60°C
-40°C To +85°C
350°C± 20°C For 3 Seconds
2000V HBM

PART NO.:



SPEC NO.: REV NO.:A-1
Spectrum Distri bution
（光谱分析图）
1.0
R
e
l
a
t< br>i
v
e

R
a
d
i
a
n
t

I
n
t
e
n
s
i
t
y
（正向电流- 电压曲线图）
F
o
r
w
a
r
d

C
u
r
r
e
n
t
(
m
A
)
1200
1050
900
750
600
450
3 00
150
0
1111.5
12
12.5
13
13 .5
14
RELATIVE INTENSITY vs WAVELENGTH
0. 75
0.5
0.25
0
350
Wavelength(nm)
Forward Voltage(V)
Foward current VS
Luminous Flux
（正向电流-发光强度图）
1.2
L
u
m
i
n
o
u
s

F
l
u
x
R
e
l
a
t
i
v
e

V
a
l
u
e

a
t

I
F
=
1
0
5
0
m
A
1.0
0.8
0.6
0.4
0

IF-Forward Current(mA)
1200
Relative Luminous Intensity VS
Ambient Temperature
（温度-光通量曲线图）
R
e
l
a
t
i
v
e

L
u
m
i
n
o
u
s

I
n
t
e
n
s
i
t
y
（
%
）
110
100
90
0
-60-40-20
Amb ient Temperature Ta（°c）
Radiation Diagram
（ 角度图）
20
30
40
50
60
70
80
90
1.00.90.80.70.60.50.40.30.20.100.10.20.30.40 .50.60.70.80.91.0
10
0
10
20
30
40
50
60
70
80
90





PAGE: 517

PART NO.: SPEC NO.: REV NO.:A-1
■ Chromaticity Diagram
（色度图）




Warm White






PAGE: 617

PART NO.:




SPEC NO.: REV NO.:A-1

Nature White




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PART NO.:

SPEC NO.: REV NO.:A-1

DaylightCool White







PAGE: 817

PART NO.:

COLOR BINS:

Color Coordinates Measurement allowance is±0.01.
色坐标测量允许误差± 0.01

SPEC NO.: REV NO.:A-1













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PART NO.: SPEC NO.: REV NO.:A-1
■
Reliability 可靠性

（1）
NO.
（序号）
Test Items And Condition 检测项目与检测条件
Items

(项目)
DC Operating Life
常温点亮
Manual Soldering
手工焊

Thermal Shock
冷热冲击
Test Condition

(测试条件)
Ta=25℃
IF=1050mA

Temp.260℃Max
5sec Max
-
40
℃30min
+100℃30min

Ta=100℃±5℃
IF=1050mA

85℃85%RH
IF=1050mA

Ta=-40℃±5℃
IF=1050mA

2000V HBM
Test
HoursCycles
测试时间周期

1000H
Sample Size AcRe
抽样数

允许标准
22 01 1
2 5 Time 22 01
3 50 Cycles 22 01
4
5
6
High Temperature
Operation

高温老化
High Temperature
High Humidity
高温高湿
Low Temperature
Operation
低温老化
ESD(HBM)

抗静电(人体模式)
168H 22 01
168H 22 01
168H 22 01
7 1 Time 10 01
(2) Criteria For Judging the Damage 实验判别标准
Items

项目
Luminous Intensity
亮度

Forward Voltage
正向电压
Reverse Current
漏电流

Note:
Symbol
符号
IV
Test Condition
测试条件

IF=1050mA

IF=1050mA

VR=20V
Limit 限度

Min.

L.S.L*0.8

-----
-----
Max.

-----
VF
IR
U.S.L*1.1

U.S.L*2.0


L.S.L : Lower Standard Level 下降标准
U.S.L : Upper Standard Level 上升标准
PAGE: 1417

PART NO.: SPEC NO.: REV NO.:A-1
Soldering Condition


Reflow Soldering


Pre-heat

Per-heat time

Peak Temperature

Soldering time
Condition
Lead Solder


120~150℃

120sec Max

240℃ Max

10 sec Max
Lead-free Solder

180~200℃

120 sec Max

260℃ Max

10 sec Max
Hand Soldering



Temperature 350℃ Max

Soldering time 3 sec Max
(one time only)
①

Lead Solder
2.5~5℃sec.
240℃ Max.
.
②

Lead-free Solder
1~5℃sec.
260℃ Max.
.
Pre-heating
120~150°C
2.5~5℃sec .
.
Above200℃
Pre-heating
180~200℃
1~5°Csec.
.
Above220℃


焊接条件
回流焊

预热
预热时间
峰值温度
焊接时间条件

铅焊料 无铅焊料
120~150℃ 180~200℃


120 Sec Max
120Sec Max


240260℃ Max

℃ Max
10 Sec Max
10 Sec Max



手工焊接

温度

焊接时间

350 ℃最高
3秒最高
（一次性使用
）


Recommend the use of environmentally friendly Lead-free Solder
建议使用对环境无害的无铅焊料
注：此焊接曲线仅供参考。

PAGE: 1517

PART NO.:
CAUTIONS：

The LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently the color of the LEDs is changed a little by an operating current. Care should be taken after
due consideration when using LED’s.

(1) Moisture Proof Package:
When moisture is absorbed into the SMT package it may vaporize and expand during soldering .There is
a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the
LEDs. For this reason, the moisture proof package is used to keep Moisture to a minimum in the
package.
(2) Storage Conditions
Before opening the package:
The LEDs should be kept at 30℃ or less and 60%RH or less. The LEDs should be used with in a year.
When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended.
After opening the package:
The LEDs should be kept at 30℃ or less and 50%RH or less. The LEDs should be soldered within 168
hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof
packages, such as sealed containers with packages of moisture absorbent material (silica gel).It is also
recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag
again.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage
time. Baking treatment should be performed using the following conditions.
Baking treatment : more than 48 hours at 80±5℃ 4h~12h (Humidity in accordance with the different
environments)

(3) Heat Generation
Thermal design of the end product is of paramount importance. Please consider the heat generation of
the LED when making the system design. The coefficient of temperature increase per input electric
power is affected by the thermal resistance of the circuit board and density of LED placement on the
board as well as other components.
The operating current should be decided after considering the ambient maximum temperature of LEDs.

（4）Cleaning
It is recommended that ethanol alcohol be used as a solvent for cleaning the LED ’s. when using other
solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin
or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations.

(5) Static Electricity
Static electricity or surge voltage damages the LEDs. .
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. All
devices, equipments and machineries must be properly grounded. It is recommended that measures be
taken against surge voltage to the equipment that mounts the LED’s .When inspecting the final products
in which LEDs were assembled. It is recommended to check. Whether the assembled LEDs are
damaged by static electricity or not. It is easy to find Static-damaged LED’s by a light –on test or a VF test
at a lower current (below 20 mA is recommended). Damaged LEDs will show some unusual
characteristics such as the leak current. Remarkably increases, the forward voltage becomes lower , or
the LEDs do not light at the low Current.

(6) Others
Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when
using the LED’s with matrix drive. The LED light output is strong enough to injure human
PAGE: 1617
SPEC NO.: REV NO.:A-1

PART NO.: SPEC NO.: REV NO.:A-1
注意事项：
eyes .Precautions must be taken to prevent looking directly at the LED’s with unaided eyes for more than
a few seconds. The LED’s described in this brochure are intended to be used for ordinary electronic
equipment（Street Lights 、Tunnel Lights 、Flashlight lamp 、miner's lamp and more) The maximum
ambient temperature should be taken into consideration when determining the operating
shall not reverse engineer by disassembling or analysis of the LED’s when defective LED’s are found ,the
User shall inform .The appearance and specifications of the product may be modified for improvement
without Notice.
发光二极管是蓝光结合特殊荧光粉实现出光的装置，LED 的工作电流的改变可干扰出光颜色，所以在使用
时应适当考虑。
(1) 防潮包装： 水分被SMT器件表面吸收后,在焊接过程中会蒸发和扩散。这可能会导致损坏发光二极管的光学特性。出于这个原因，防潮包装是用来抑制外部水气的.
(2) 存储 贮藏条件
开封前的包装:
发光二极管应保持在30℃或以下，相对湿度60％或更少的状态。发光二极管的使用期限应在一年内。
遵照防潮包装中吸水材料（硅胶）的建议.
开封后的包装：
发光二极管应保持在 30℃或以下，相对湿度50％或更少的状态。发光二极管的焊接应在打开防潮包装后
168H(7天) 内完成。如果有未使用完的发光二极管，应重新将它们存放在防潮包装内，遵照防潮包装中
吸水材料（硅 胶）的建议.建议未使用完的发光二极管,重新封装入防潮袋一次。当储存的发光二极管
(LED)已经 超过了合理的存储时间，应采用下列条件进行烘干处理.
烘烤处理：超过48小时，在80±5℃ 4H~1
2H
(按照不同环境湿度）.
(3) 产生的热量
最终散热设 计是应用产品至关重要的。请系统设计时考虑LED工作时产生的热量,输入的电功率,温度
系数的增加 ,热传导电路装置设置及其他组件.这些都是非常必要的.工作电流决定后，LED所能承受的
最高的环 境温度也应当得到保证.
(4) 清洗
建议使用浓度低的乙醇酒精作为LED的清洗溶剂. 当使用其它溶剂时，应当事先确认是否会对封装结
构及硅胶产生危害.依照世界各地的法则及规定, 氟利昂溶剂是不能用来清洁LED的.
(5) 静电
静电或浪涌电压是可以对LED产生致 命伤害的。建议使用及处理发光二极管时佩戴防静电手腕带或防静
电手套。所有设备和机械必须妥善接地 。这个措施适用于所有安装了LED的设备，完全考虑到组装的最
终产品.在LED的组装过程中，建议 检查是否有对发光二极管体器件造成了静电损伤.人们能够很容易找
到静电对器件造成了破坏. (建议:在低的电流环境下 <20mA)受损了的LED将显示一些不寻常的特点，
如漏电流值的增加 ，正向电压变低，或LED死灯。
(6) 其它
必须注意，使用的LED的矩阵驱动器，要 确保反向电压不会超过最大额定值，LED的光输出强度足以让人的眼
产生不适.必须采取预防措施.以 保障直视LED不超过几秒钟。这本发光二极管规格书中所描述的器件
是用于普通的电子设备（路灯、隧 道灯、手电筒灯、矿灯等等）运行在最高环境温度下，应考虑合适
的工作电流。发现产品缺陷后， 用户 应告知我们，不得自行进行发光二极管解剖及分析等的反向工艺。
产品的外观和规格可进行修善，恕不另 行通知。


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